packaging

时间:2024-10-27 14:59:00编辑:莆田seo君

Maven中的参数分别是什么意思?

刚刚接触maven,大概回答下……

asia.banseon

banseon-maven2

1.0-SNAPSHOT

jar
====================================
使用mvn archetype:generate创建新项目时需要指定archetypeGroupId和archetypeArtifactId,archetypeGroupId代表该项目所在的小组,archetypeArtifactId简单指定一个项目的名字。
archetypeCatalog :参数,指定已定义的模板创建工程。
interactiveMode:是否希望maven与用户输入进行交互,true的话,maven就有可能与用户交互,默认是true


maven type bundle什么意思

就是用maven配置bundle工程。
1.在src\main\resources路径下配置features.xml文件,内容如下:

<features xmlns="http://karaf.apache.org/xmlns/features/v1.0.0"
xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
xsi:schemaLocation="http://karaf.apache.org/xmlns/features/v1.0.0 http://karaf.apache.org/xmlns/features/v1.0.0"
name="esbconsoleRepository">
mvn:${project.groupId}/${project.artifactId}/${project.version}/xml/features


camel-http
camel-jetty
mvn:${project.groupId}/${project.artifactId}/${project.version}



2.pom.xml文件要点
2.1:打包成bundle格式文件
bundle
2.2:配置构建所需插件



org.apache.felix
maven-bundle-plugin
2.3.7
true


${project.artifactId}
${project.description}
*
!*
!antlr.*,!gnu.*,!javassist.*,!javax.persistence.*,!javax.xml.rpc*,!junit.*,* -->
com.csair.cod.route*;version=${project.version}
log4j,svc-sample-fuse-lib,jbossall-client,testejb;scope=compile|runtime|system




maven-compiler-plugin
2.3.2

1.6
1.6
UTF-8

true
128m
256m
<!-- if it doesn't work, try 768M, it seems that UTF-16 consumes more
memory -->



maven-resources-plugin
2.4.3


copy-resources
validate

copy-resources


${basedir}/target


src/main/resources
true







org.codehaus.mojo
build-helper-maven-plugin


attach-artifacts
package

attach-artifact




target/features.xml
xml
features









src/main/resources
true



封装英文

封装的英文是:packaging。封装:1、Encapsulation and Catalytic Activity of Lipophilic Soluble Metallophthalocyanine Derivative in MCM-41.脂溶性金属酞菁衍生物在介孔分子筛中的封装及其催化性质研究。2、The Encapsulation and Application of Workflow System in Manufacturing Grid.制造网格环境下工作流系统的封装和应用。3、State-of-art in Simulation of Brazing Packaging for Miniaturized Multi-channel Heat Exchanger.微小型多通道换热器钎焊封装仿真研究现状。4、Thermal Conductive High Performance Polymer Microelectronic Packaging Material(Ⅰ):Preparation of the Packaging Material.导热型高性能树脂微电子封装材料之一:封装材料的制备。相关例句:1、有迹象表明,细胞内的藻类可能直接向封装它们的蝾螈细胞提供光合作用的产物。There are signs that intracellular algae may be directly providing the products of photosynthesis to the salamander cells that encapsulate them.2、“封装能保护细胞免遭免疫系统攻击,并且会含有畸胎瘤细胞。” Weir 说。'Encapsulation protects cells from getting killed by the immune system and would contain teratoma cells,' says Weir.3、条例规定样品必须用两个不漏水的容器封装起来。The rules state that samples must be enclosed in two watertight containers.4、制造一部手机的成本和它在商店里的价格之间的差距应该会进一步扩大,因为以前元件被封装在一个主芯片上。The gap between the cost of building a phone and its price in the shops should widen further as previously components are packed onto a single main microchip.5、抗辐照玻璃盖片的封装操作是空间太阳能电池方阵制造过程的重要环节。The bonding of anti-irradiating coverglass is the important point in the manufacturing process.

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